Reconsider Prob. 858. Using EES (or other) software investigate

Reconsider Prob. 858. Using EES (or other) software investigate the effects of air velocity at the inlet of the channel and the maximum surface temperature on the maximum total power dissipation of electronic components. Let the air velocity vary from 1 m/s to 20 m/s and the surface temperature from 30C to 90C. Plot the power dissipation as functions of air velocity and surface temperature and discuss the results. Problem. 858 A 15-cm 20-cm printed circuit board whose components are not allowed to come into direct contact with air for reliability reasons is to be cooled by passing cool air through a 20-cm-long channel of rectangular cross section 0.2 cm 14 cm drilled into the board. The heat generated by the electronic components is conducted across the thin layer of the board to the channel where it is removed by air that enters the channel at 15C. The heat flux at the top surface of the channel can be considered to be uniform and heat transfer through other surfaces is negligible. If the velocity of the air at the inlet of the channel is not to exceed 4 m/s and the surface temperature of the channel is to remain under 50C determine the maximum total power of the electronic components that can safely be mounted on this circuit board. As a first approximation assume flow is fully developed in the channel. Evaluate properties of air at a bulk mean temperature of 25C. Is this a good assumption?

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